Neu-X302-Series

Construction Chassis:

Châssis Métal

СPU Generation/Family:

Coffee Lake, Coffee Lake Refresh

Type processeur Supporté:

Intel Core i7-8700T, Intel Core i5-8500T, Intel Core i3-8100T, Intel Core i3-9100TE, Intel Core i5-9500TE, Intel Core i7-9700TE

Socket:

LGA1151

Chipset:

Intel Q370 (or H310)

Type de mémoire:

DDR4 RAM

Type de socket:

2xSODIMM 260-pin

Type assemblage:

Transportable

Max. Mémoire:

32 GB

ECC:

Non

Controleur graphique:

Intégré au processeur, Intel UHD Graphics 630

Type connecteur:

Intel i211-AT 10/100/1000 Mbps, Intel i219-LM

Total Ethernet:

2

10/100/1000 Mbit/s:

2

Total COM:

6

RS-232:

3 (Front)

RS-232/422/485:

3 (Rear)

Total USB:

10

USB 2.0:

6 (6x through headers on board (for Q370); 3x through headers on board (for H310))

USB 3.0:

4 (Rear)

GPIO:

4xDigital In / 4xDigital Out

Controleur Audio:

Realtek ALC888

Canal SATA3:

1

Baie 2,5'':

SATA 3, SSD

2.5" Baie Interne:

1

Total:

2

M.2:

2 (1x 2230 Key-E for Wi-Fi/Bluetooth module, 1x 2242/3042 Key-B for optional SSD/3G/4G)

Quantité SIM Holder:

Yes, 1 (slot)

Type:

Fanless

Connecteurs:

6xDB9, DB15 VGA, HDMI, 2xRJ45, 4xUSB, Mic In, Line Out, SIM Card Slot, 4-pin DC input

Entrée Voltage DC:

12 ... 12 V

Type d'alimentation:

Adaptateur Externe AC/DC

Sortie Alimentation:

96 W

Compatibilité Système d'exploitation:

Linux OS, Windows 10

Largeur:

200 mm

Hauteur:

64.3 mm

Profondeur:

190 mm

Température:

-5 ... 45 °C

Humidité:

10 ... 95 % (non-condensing)

Vibration:

Random: 2Grms @ 5~500 Hz, IEC60068-2-64; Sinusoidal: 2G @ 5~500 Hz, IEC60068-2-6

Chocs:

50G peak acceleration, 11ms according to IEC60068-2-27

Certifications:

CE, FCC Class A

Chocs et vibrations:

IEC 60068-2-6, IEC 60068-2-27, IEC 60068-2-64

EMS:

EN 55032, EN 55035

Nom:

NEXCOM