TT-300-F33

Construction Chassis:

Châssis Métal, Châssis Aluminium

Configuration Montage:

Assemblage, Desktop, Montage mural

Type processeur Supporté:

Intel Celeron, Intel Core i3, Intel Core i5, Intel Core i7 (6, 7, 8, 9th Gen)

Processeur Installé:

Intel Core i7-8700T

Fréquence:

2.4 GHz

Type de mémoire:

DDR4 2133, DDR4 RAM, DDR4 2400, DDR4 2666

Type de socket:

1xDDR4 SODIMM 260-pin

Type assemblage:

Transportable

Max. Mémoire:

16 GB

Type connecteur:

Intel i210-IT, Intel i219-LM

Total Ethernet:

2

10/100/1000 Mbit/s:

2

Format Wlan:

Yes (via extensions)

Total COM:

6

RS-232:

4

RS-232/422/485:

2

Total USB:

4

USB 3.0:

4

Baie 2,5'':

2xSATA 3

mSATA Support:

Yes (1xM.2 2280 Key M (PCIex1, SATA), 1xmSATA(co-lay with mini-PCIe))

Total:

6

PCI Express x4:

2 (Only PCIex1 signal; card length 169mm max)

PCI Express x16:

1 (Card length 220mm max)

Mini-PCIe/Mini Card:

1 (Wi-Fi/3.5G/4G LTE (co-lay with mini-PCIe))

M.2:

2 (1xM.2 2280 Key M (PCIex1, SATA), 1xM.2 2242/3042 Key B (PCIex1, USB2.0))

Quantité SIM Holder:

Yes, Nano SIM

Type:

Fanless

Connecteurs:

2xDB9, 4xDB9, 2xHDMI, 2xRJ45 Ethernet, 4xUSB

Entrée Voltage DC:

12 ... 24 V

Compatibilité Système d'exploitation:

Windows 10

Largeur:

269 mm

Hauteur:

136 mm

Profondeur:

159 mm

Température:

-5 ... 50 °C

Humidité:

10 ... 95 %

Vibration:

Random: 2Grms @ 5~500 Hz, IEC60068-2-64; Sinusoidal: 2Grms @ 5~500 Hz, IEC60068-2-6

Chocs:

mini-PCIe: 20G, half sine, 11ms, IEC60068-2-27; M.2: 50G, half sine, 11ms, IEC60068-2-27

Certifications:

CE, IEC 61000-6-2, IEC 61000-6-4, FCC Class A

Chocs et vibrations:

IEC 60068-2-6, IEC 60068-2-27, IEC 60068-2-64

Nom:

NEXCOM